linkage heat

In order to improve the thermal effect of lasing crystal,a composite crystal of Nd:YVO_4/YVO_4 is made using the diffusion bonding method.

为改善高功率激光器激光工作物质的热效应,本文采用热键合的方法研制了Nd:YVO4/YVO4复合晶体,键合晶体的波前干涉P-V值为0。

A composite YAG/Nd:YAG crystal was obtained by using the thermal bonding technique under a specific temperature and pressure.

本文在一定的温度和压力下,通过热键合技术,获得了YAG/Nd:YAG复合晶体。

The composite Yb:Y_3Al_5O_(12)/Y_3Al_5O_(12) crystal was made by thermal bonding method.

采用热键合技术制备了Yb:Y_3Al_5O_(12)/Y_3Al_5O_(12)(Yb:YAG/YAG)复合晶体,对复合晶体进行了结构表征和键合质量检测。

The latest development of planar waveguide lasers is summarized, including thermal bonding technique, new idea of double-clad pumping planar waveguide and passively Q-switched double-clad waveguide laser.

介绍了热键合双包层平板波导激光器的研究进展,包括热键合技术的优越性,双包层平板波导的新思想,集成可饱和吸收体的被动调Q波导激光器。

Dynamic characteristics study of piezoelectric transducer for thermosonic bonding;

热超声键合压电换能器的动力学特性

The system of the ultrasonic transducer is the key component of the bonding equipment in the thermosonic bonding system.

在热超声键合系统中,超声换能系统是键合装备的核心部分。

Electrifying-electrodes Assisted Thermal Bonding Method and Fabrication of Multi-metal Microelectrodes Integrated on the Single Substrate

电极通电辅助热键合与多种金属微电极的单片集成

Hydrothermal synthesis and structural characterization of one novel cuprum imidazole complexes having hydrogen-bonded frameworks

水热合成具有氢键网络的铜咪唑化合物(英文)

glucosidic linkage

糖苷键[合],苷键[合]

Power Bond Graph Theory Study and Its Application in Thermal System;

功率键合图理论及其在热工对象上的应用研究

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System

热超声键合换能系统接触界面非线性振动研究

Stress Damage on Vertical Structure GaN-Based LEDs

垂直结构GaN基LEDs热压键合应力损伤分析

Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding

热超声倒装键合中温度对对准精度的影响

Effects of Annealing and Drawing on Properties of Single Crystal Copper Bonding Wire

冷变形和热处理对单晶Cu键合丝性能影响

Research of Key Technologies of Thermal Conductive Composite Compact Plate-Shell Heat Exchanger;

导热复合材料紧凑型板壳式换热器关键技术研究

Melamine phosphate is the key material to guarantee the comprehensive performances for insulting layer.

三聚氰胺磷酸盐是保障绝热层综合性能的关键材料。

Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;

热超声倒装键合界面运动与界面性能的生成规律研究

The Integration and Optimization of Heat Exchanger Networks and Key Technology Research of Equipment s Characteristic Parameter;

换热网络综合优化及设备特征参数的关键技术研究

Research on Hot Embossing and Bonding for Fabrication of Plastic Microfluidic Chips;

塑料微流控芯片微通道热压成形及键合工艺研究

Electrical/Thermal Properties and Crystallization Kinetics of RAS Glass-ceramics for Anodic Bonding

阳极键合用RAS系微晶玻璃电学/热学性能及其析晶动力学研究

Research of Multi-Pass Plate Hot Rolling by Mathematic Model

中厚板热轧综合解析数值法建模的几个关键问题研究

THE KEY TECHNIQUES FOR CALCULATION OF THE SOLID-ELASTIC STRESS FIELD WITH THE FINITE DIFFERENCE METHOD

应用有限差分进行涡轮气热弹耦合计算关键性问题的研究

Please fix hotkey then:

请牢记您的“热键”目前是：