hot melt

Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist;

后烘温度对SU-8光刻胶热溶胀性及内应力的影响

Basing on the fabrication of micro mold insert by existing UV-LIGA technique,regularity of SU-8 thermal swelling was simulatively analyzed with ANSYS.

对SU-8胶的热溶胀效应及其机理进行了研究,在现有微模具的UV-LIGA工艺的基础上,利用AN-SYS对SU-8胶的热溶胀性规律进行了仿真分析。

Preparation of submicron zinc borate with low hydrous content by solvothermal treatment;

溶剂热改性法制备亚微米级低水硼酸锌