flexible copper-clad dielectric film

The application of the polyimiders to two-layer flexible copper clad laminate(2L-FCCL)was researched.

用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。

The current situation and development of halogen-free flexible copper clad laminate were summarized, in which the halogen-free epoxy resins and the flame-retardant mechanism of phosphorated flame-retardant were introduced chiefly.

介绍挠性覆铜板(FCCL)的现况及无卤化进展,重点阐述了常用的无卤环氧树脂和磷系阻燃剂的阻燃机理及其种类,并在此基础上浅述了未来的发展趋势。

Synthesis of ingrain fireproofing polyacrylate and its adhesive in FCCL;

本体阻燃丙烯酸酯胶粘剂的合成及其在挠性覆铜板中的应用

The polyimides applied to two-layer flexible copper clad laminate(2L-FCCL) were researched,the 2L-FCCL showes excellent solder resistance and low water-absorption.

用BAB与多种二酐合成出多种聚酰胺酸,并在二层法挠性覆铜板(2L_FCCL)的应用方面做了一些探索。

A varnish used for FCCL was prepared with phosphorated epoxy resin, carboxyl-terminated acrlonitrile butadiene rubber(CTBN) and phosphorated flame retardant SPB-100.

采用端羧基丁腈橡胶(CTBN)增韧改性含磷环氧树脂体系,配合使用添加型磷系阻燃剂SPB-100得到挠性覆铜板用胶液,以此制备的环保型挠性覆铜板不含卤素、锑和铅、汞、镉、六价铬等有害重金属,满足欧盟RoHS指令要求,板材剥离强度为1。

flexible copper-clad dielectric film

挠性覆铜箔绝缘薄膜

Flexible copper-clad polyimide film for printed circuits

GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜

Flexible copper-clad polyester film for printed circuits

GB/T13556-1992印制电路用挠性覆铜箔聚脂薄膜

Test methods for flexible copper-clad material for printed circuits

GB/T13557-1992印制电路用挠性覆铜箔材料试验方法

flexible delivery pipe with vacuum insulation

真空绝缘挠性输液管

Synthesis and Properties of Barium Strontium Titanate Thin Films on Copper Foils

钛酸锶钡薄膜在金属铜箔上的制备及其性能研究

Tansport Properties of Metal-Insulater Granular Films;

金属—绝缘体颗粒薄膜的输运特性研究

Study on Metal–Insulator Transition (MIT) Property of Vanadium Oxide Thin Film

氧化钒薄膜金属—绝缘体相变特性研究

Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板

Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)

Research on Processing and Dielectric Properties of Surface Films on Insulating Metallic Substrates;

绝缘金属基板表面绝缘薄膜的制备和介电性能研究

Studies on the Effects of Insulator Layers on the Performance of Organic Thin Film Transistors;

绝缘层对有机薄膜晶体管性能影响的研究

Evaluation of Aging Property of Nano-filled Insulation Resin Used for Inverter-fed Motor

变频电机用纳米复合绝缘薄膜老化性能的评估

epoxide woven glass fabric copper-clad laminates

环氧玻璃布基覆铜箔板

ployester woven glass fabric copper-clad laminates

聚酯玻璃布覆铜箔板

UV Blocking copper-clad laminates

紫外线阻挡型覆铜箔板

metal core copper-clad laminate

金属芯覆铜箔层压板

" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"

GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)