flat package

5mm lead pitch,208-pin quad flat package(QFP) component which have 25 different process parameters' levels combinations were designed.

5mm引脚间距四方扁平封装(Quad Flat Package:QFP)器件焊点;建立了这25种焊点的三维形态预测模型和三维有限元分析模型;对热循环加载条件下QFP焊点进行了非线性有限元分析,基于塑性应变采用Coffin-Manson方程计算了25种不同焊点形态的QFP焊点热疲劳寿命;针对热疲劳寿命计算结果,进行了极差分析与方差分析。